MemSilicon has announced the successful tape-out of its MountTai 2026 chip, a 1Gb RRAM (resistive random-access memory) device utilizing a 1T4R (one transistor, four resistors) architecture. This marks a significant milestone as it is claimed to be the first high-density, large-capacity RRAM chip at the gigabit scale. The chip is manufactured using a 28nm CMOS process, achieving a density of 30Mb/mm² and an access time of under 20ns, with integrated error correction code (ECC). AI
IMPACT This advancement in high-density, large-capacity memory could accelerate the development of AI hardware by enabling more parameters and data to be stored on-chip.
RANK_REASON First tape-out of a gigabit-scale RRAM chip with 1T4R architecture by a company. [lever_c_demoted from frontier_release: ic=2 ai=0.7]
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