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GlobalFoundries to produce TSMC silicon interposers in US for $2B

By PulseAugur Editorial · [2 sources] ·

GlobalFoundries and TSMC have signed a five-year, $2 billion agreement for GlobalFoundries to produce silicon interposers in the US. These interposers are crucial components for TSMC's CoWoS advanced packaging technology, enabling the creation of complex processors for AI and high-performance computing. Production is slated to begin in the first half of 2028 at GlobalFoundries' facility in Malta, NY, aiming to establish a secure, US-based supply chain for these critical semiconductor elements. AI

IMPACT Strengthens US semiconductor supply chain for AI and HPC components, potentially reducing reliance on overseas manufacturing.

RANK_REASON Partnership between two major semiconductor companies for US-based advanced packaging component manufacturing. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on Tom's Hardware →

AI-generated summary · Google Gemini · from 2 sources. How we write summaries →

GlobalFoundries to produce TSMC silicon interposers in US for $2B

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29 / 100
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Research
Partnership between two major semiconductor companies for US-based advanced packaging component manufacturing. [lever_c_demoted from significant: ic=1 ai=0.7]
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2 independent sources
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infra, product
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High
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Breaking (< 6h)
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COVERAGE [2]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

    GlobalFoundries becomes a part of TSMC's CoWoS supply chain in the U.S.: set to participate in production of leading-edge AI and HPC accelerators without investing in leading-edge process technologies.

  2. The Register — AI TIER_1 English(EN) ·

    TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal

    Advanced packaging tech is essential to the domestic production of high-performance semiconductors used in AI datacenters

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