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Samsung, TSMC to adopt ASML's advanced EUV tech by 2030

By PulseAugur Editorial · [1 sources] ·

Samsung and TSMC are set to adopt ASML's advanced High NA EUV lithography machines, with Samsung aiming for 2028 and TSMC for 2030. This technology, previously exclusive to Intel, is crucial for producing next-generation chips. Both companies are also joining an initiative with ASML to transition to larger 12-inch photomasks, a move expected to increase manufacturing capacity, lower costs, and simplify production by eliminating the need to "stitch" chip patterns. AI

IMPACT Accelerates the production of more advanced chips, potentially enabling more powerful AI hardware.

RANK_REASON Major semiconductor manufacturers Samsung and TSMC committing to adopt new, advanced lithography technology from ASML. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on Engadget →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

Samsung, TSMC to adopt ASML's advanced EUV tech by 2030

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Major semiconductor manufacturers Samsung and TSMC committing to adopt new, advanced lithography technology from ASML. [lever_c_demoted from significant: ic=1 ai=0.7]
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COVERAGE [1]

  1. Engadget TIER_1 English(EN) · [email protected] (Steve Dent) ·

    Samsung and TSMC hope AMSL's new machines will help address the chip shortage

    ASML, TSMC and Samsung are adopting larger chip photomasks that will boost manufacturing yields and lower costs.

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