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Google reportedly taps Intel's EMIB-T for new TPUs, challenging TSMC's packaging dominance

By PulseAugur Editorial · [1 sources] ·

Google is reportedly shifting its next-generation TPU development, codenamed Humufish, from TSMC's CoWoS packaging to Intel's EMIB-T technology. This move signifies a potential challenge to TSMC's dominance in advanced chip packaging, which has been the industry standard for AI and HPC processors. The decision, if accurate, highlights the growing importance of supply chain diversification and the competitive landscape between Intel and TSMC in providing advanced packaging solutions for hyperscalers. AI

IMPACT This reported shift could signal increased competition and innovation in advanced chip packaging, potentially impacting AI hardware development and supply chains.

RANK_REASON Reported shift in major hyperscaler's adoption of advanced chip packaging technology. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on Tom's Hardware →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

Google reportedly taps Intel's EMIB-T for new TPUs, challenging TSMC's packaging dominance

COVERAGE [1]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

    Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

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