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Multi-source AI news clustered, deduplicated, and scored 0–100 across authority, cluster strength, headline signal, and time decay.

  1. RESEARCH · 36氪 (36Kr) 中文(ZH) ·

    Hongban Technology: AI server PCB-related products are currently still in the client product verification stage

    Hongban Technology has successfully completed technical verification for its PCB products related to 800G and 1.6T optical modules, with downstream clients including several leading companies in the industry. The company is currently in small-batch production for these optical module PCBs, with shipments arranged according to client project timelines. In parallel, AI server PCB products are still undergoing client verification, with mass production dependent on customer test results and project progression. Separately, TSMC is collaborating with Ibiden and Innolux to validate the feasibility of using glass substrates in CoWoS advanced packaging, marking a significant step towards industrialization, though widespread mass production is still some time away. AI

    IMPACT Advancements in high-speed PCBs and packaging technologies are crucial for scaling AI infrastructure and improving model performance.

  2. TOOL · 36氪 (36Kr) 中文(ZH) ·

    TSMC reportedly releases glass substrate development plan to supply chain, disclosing technical progress for the first time

    TSMC has initiated a development plan for glass substrates within its CoWoS advanced packaging technology, collaborating with Ibiden and Innolux to assess feasibility. This marks TSMC's first public disclosure of its glass substrate progress, signaling a move toward industrial validation, though full-scale production remains distant. The plan involves continued research into glass thickness and large-scale CoWoS packaging layouts. AI