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Multi-source AI news clustered, deduplicated, and scored 0–100 across authority, cluster strength, headline signal, and time decay.

  1. RESEARCH · 36氪 (36Kr) 中文(ZH) ·

    MediaTek: Next-generation chips will exclusively adopt Intel's EMIB-T packaging, mass production expected in Q4 2027

    MediaTek has announced that its next-generation chips will exclusively utilize Intel's EMIB-T advanced packaging technology, moving away from TSMC's CoWoS solution. The company aims for a tape-out of this new chip in Q4 2026, with mass production scheduled for Q4 2027. This strategic shift highlights a significant partnership in the semiconductor industry. AI

    IMPACT This partnership could influence the supply chain and performance of future AI hardware by leveraging Intel's advanced packaging.

  2. COMMENTARY · 36氪 (36Kr) 中文(ZH) ·

    Agency: Global OLED Panel Manufacturers' Luminescent Material Procurement Expected to Reach $2.54 Billion This Year

    Market research firm UBI Research has lowered its global OLED emissive material procurement forecast for this year to $2.54 billion, a 12.8% decrease from its previous prediction. This downward revision is attributed to rising memory prices impacting smartphone sales and subsequently, OLED panel shipments. In separate news, MediaTek announced its next-generation chips will exclusively use Intel's advanced EMIB-T packaging technology, moving away from TSMC's CoWoS solution, with mass production slated for Q4 2027. AI