Ming-Chi Kuo: CoPoS to be mass-produced in the second half of 2028, glass and ABF have no substitution relationship
A new advanced packaging technology from TSMC, called CoPoS, is slated for mass production in the latter half of 2028. This technology integrates glass substrates and ABF (Ajinomoto Build-up Film) for chip interconnections, with research indicating they will coexist rather than one replacing the other. Separately, ByteDance is reportedly initiating a spin-off and fundraising for its AI drug discovery unit, signaling a move towards industrialization in the AI for Science (AI4S) sector. AI
IMPACT TSMC's CoPoS packaging may enable more powerful AI chips, while ByteDance's AI drug discovery spin-off could accelerate pharmaceutical innovation.