ENTITY Glass substrate

Glass substrate

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RESEARCH · CL_84575 · Jun 11 · 03:02

TSMC's CoPoS advanced packaging to launch 2028; ByteDance spins off AI drug discovery

A new advanced packaging technology from TSMC, called CoPoS, is slated for mass production in the latter half of 2028. This technology integrates glass substrates and ABF (Ajinomoto Build-up Film) for chip interconnecti…