Huawei Produces 122TB SSD Using Proprietary Chip Packaging Technology
Huawei has developed a new 122TB SSD for data centers and AI inference, circumventing US sanctions on advanced 3D NAND chips. The company utilizes a proprietary Die-on-Board (DoB) packaging technique, which mounts NAND dies directly onto the PCB, increasing density without relying on foreign, sanctioned technology. This innovation allows Huawei to use less dense Chinese-made NAND chips to achieve high capacities, potentially fostering greater independence in China's semiconductor industry. AI
IMPACT Enables development of high-density storage solutions for AI infrastructure, potentially reducing reliance on foreign technology.