ENTITY G11 3D NAND

G11 3D NAND

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RESEARCH · CL_318222 · Oct 23 · 15:32

Micron unveils 400+ layer 3D NAND with wafer-on-wafer bonding

Micron has announced its next-generation G11 3D NAND technology, set to enter mass production in the second half of 2027. This new technology will feature over 400 layers and utilize wafer-on-wafer bonding to double bit…