ENTITY
die
die
PulseAugur coverage of die — every cluster mentioning die across labs, papers, and developer communities, ranked by signal.
Total · 30d
1
2 over 90d
Releases · 30d
0
0 over 90d
Papers · 30d
0
1 over 90d
TIER MIX · 90D
TOPICS
SENTIMENT · 30D
1 day(s) with sentiment data
RECENT · PAGE 1/1 · 2 TOTAL
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Intel patents MicroLEDs embedded in CPU packaging for aesthetics and diagnostics
Intel has patented a method for embedding MicroLEDs directly into CPU packaging, utilizing a glass substrate and through-glass vias (TGVs). This technology could serve dual purposes: providing aesthetic lighting effects…
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New virtual metrology approach predicts phototransistor gain with uncertainty awareness
Researchers have developed a novel virtual metrology approach to predict phototransistor gain using a hierarchical, uncertainty-aware method. This technique is designed for small production datasets, addressing the chal…