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ENTITY Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration

Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration

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  1. TOOL · CL_322226 ·

    imec researchers explore 3D DRAM stacking above GPUs

    Researchers at imec have published a paper detailing a novel 3D memory architecture that stacks DRAM dies vertically above a GPU. This approach aims to expand the thermal design envelope for integrated memory solutions,…