ENTITY Albany NanoTech

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RESEARCH · CL_322792 · Oct 26 · 14:00

Micron advances DRAM with wafer bonding, High-NA EUV, and vertical memory

Micron is advancing its DRAM technology by planning to integrate wafer bonding with its 1ε process and adopt High-NA EUV lithography for future generations. The company is also exploring 3D DRAM structures and developin…