3D dram structure with high mobility channel
PulseAugur coverage of 3D dram structure with high mobility channel — every cluster mentioning 3D dram structure with high mobility channel across labs, papers, and developer communities, ranked by signal.
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Yizhu Technology raises over 1 billion yuan for AI unified compute-memory chips
Yizhu Technology, a Chinese company specializing in AI computing chips with a unified compute-memory architecture, has secured over 1 billion yuan in funding. The company focuses on its GP-IMC® architecture and aims to …
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AI drives hardware innovation surge at IEEE Hot Chips Conference
The 2026 IEEE Hot Chips Conference saw a record attendance, signaling a resurgence in hardware innovation, particularly in memory and storage technologies crucial for AI workloads. Key discussions included advancements …
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AI infrastructure sees memory innovation, price hikes, and cognitive cost concerns
New developments in AI infrastructure are emerging, with d-Matrix announcing Raptor, a 3D DRAM stack promising high bandwidth at significantly lower power consumption than current High Bandwidth Memory (HBM) standards. …