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中文(ZH) 龙蟠科技:拟配售1500万股H股,预计净筹资约1.94亿港元

Longpan Technology Plans HK$194M Share Placement

Longpan Technology announced plans to issue up to 15 million new H shares at HK$13.09 per share, aiming to raise approximately HK$194 million. The funds are earmarked for general working capital for the Jintan project, including raw material procurement, utilities, and salaries, with a portion also allocated to loan repayment. This placement is subject to the approval of the Hong Kong Stock Exchange. AI

RANK_REASON The cluster reports on a significant funding event for a publicly traded company. [lever_c_demoted from significant: ic=1 ai=0.1]

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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Longpan Technology: Plans to place 15 million H shares, expecting to raise net proceeds of approximately HK$194 million

    36氪获悉,龙蟠科技公告,公司拟按每股13.09港元配售最多1500万股新H股,配售价较6月16日收市价14.37港元折让约8.91%。预计所得款项净额约1.94亿港元(净配售价约12.91港元)。其中约1.14亿港元拟用于金坛项目的一般营运资金(包括采购原材料、公用事业费及员工工资等),约8000万港元拟用于偿还部分贷款。配售股份占已发行H股约12.50%,须待香港联交所上市批准等先决条件达成后方可完成。