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SemiAnalysis teardown: SMIC 7nm beats Intel 18A pitch, lags density

By PulseAugur Editorial · [1 sources] ·

SemiAnalysis has opened a new chip teardown lab and released its first analysis, focusing on Huawei's HiSilicon Kirin 9030 processor. The teardown reveals that SMIC's 7nm process achieves a tighter metal pitch than Intel's 18A, but lags significantly in transistor density. This advanced process, developed without EUV lithography, results in a chip that performs comparably to Android flagships from three years ago. AI

RANK_REASON Analysis of chip manufacturing processes and performance by a specialized lab. [lever_c_demoted from research: ic=1 ai=0.1]

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AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

SemiAnalysis teardown: SMIC 7nm beats Intel 18A pitch, lags density

COVERAGE [1]

  1. Tom's Hardware TIER_1 English(EN) · Luke James ·

    Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

    SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.

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