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中文(ZH) 芯联集成:拟出资30.12亿元投资12英寸车规级芯片制造项目

Xinxin Integrated Circuits invests $3.01B in automotive chip factory

Xinxin Integrated Circuits plans to invest 3.012 billion yuan in a new 12-inch automotive-grade chip manufacturing project. This initiative, in collaboration with Hangshao Airport, will establish a production line capable of producing 50,000 chips per month. The project aims to focus on advanced technologies like 40/28nm MCU/DSP and 55nm silicon photonics, with a total planned investment of approximately 20 billion yuan. AI

IMPACT This investment in advanced automotive chip manufacturing could accelerate the development and deployment of AI-powered features in vehicles.

RANK_REASON Significant investment in AI-adjacent infrastructure by a major company. [lever_c_demoted from significant: ic=1 ai=0.7]

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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Xinxin Integrated: Plans to Invest 3.012 Billion Yuan in 12-inch Automotive-grade Chip Manufacturing Project

    36氪获悉,芯联集成公告,公司拟与杭绍临空合作,投资芯联先进集成电路制造(绍兴)有限公司,作为芯联12英寸车规级数模混合芯片制造项目实施主体,建设一条5万片/月的12英寸集成电路车规级数模混合芯片生产线,主要技术和产品方向为40/28纳米MCU/DSP、90/55纳米BCD/DrMOS等模拟电路、55纳米硅光/激光驱动等芯片。项目计划总投资约200亿元,其中资本金120亿元,芯联集成拟出资30.12亿元。本次投资事项完成后,公司对芯联先进的持股比例将由100%降低至25.1%。