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中文(ZH) 工信部:加强高端光电芯片和器件研发

China plans AI-driven upgrades for optoelectronic chips and networks

China's Ministry of Industry and Information Technology (MIIT) has released a new policy plan for 2026-2028 focused on integrating AI with information and communications technology. The plan emphasizes strengthening research and development in high-end optoelectronic chips, high-speed backbone networks, and AI-compatible communication infrastructure. Key areas include advancing technologies for high-speed optoelectronic chips, optical switching devices, and optical-electrical co-packaged devices, alongside developing advanced computing network technologies and wide-area intelligent computing network transmission. AI

IMPACT This policy aims to accelerate the development of critical AI hardware and network infrastructure, potentially boosting China's AI capabilities.

RANK_REASON Government policy announcement regarding AI infrastructure development.

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 2 sources. How we write summaries →

China plans AI-driven upgrades for optoelectronic chips and networks

COVERAGE [2]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    MIIT: Strengthen R&D of High-end Optoelectronic Chips and Devices

    36氪获悉,工信部印发《“人工智能+信息通信”创新发展实施意见(2026—2028年)》的通知。加强高端光电芯片和器件研发:加强高速光电芯片、高速转发/交换芯片、全光交换器件、光电共封装器件等技术和产品研发验证,开展光电混合组网技术试验,加速技术方案成熟。加强智算超节点光电互联技术攻关,开展智算网络技术与产品验证。加强广域智算网络传输技术研究试验:加大广域无损网络、任务式调度、算网运维智能体等技术验证和落地,提升算间网络调度能力和传输效率,降低比特带宽成本。

  2. Pandaily TIER_1 English(EN) · [email protected] (Pandaily) ·

    MIIT Calls for Strengthened R&D of High-End Optoelectronic Chips in New AI Communications Policy Plan

    China's MIIT issued a 2026-2028 policy plan calling for accelerated R&D of high-end optoelectronic chips, 800Gbps backbone networks, and AI-compatible communications infrastructure.