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中文(ZH) 京东方A：布局玻璃基封装载板、钙钛矿和MicroLED光互联相关应用作为未来业务发展的重要方向】

BOE Technology eyes glass substrate, perovskite, and MicroLED for future growth

By PulseAugur Editorial · [1 sources] ·

BOE Technology Group is focusing on glass substrate packaging, perovskite, and MicroLED optical interconnect applications as key future business directions. This strategy leverages their established display technology, glass substrate processing, and large-scale integrated manufacturing capabilities. The company also noted that TV panel prices saw a general increase from January to April 2026 due to factors like sports event demand and cost pressures, with prices stabilizing in May. AI

IMPACT Focus on advanced materials and interconnects could enable future AI hardware advancements.

RANK_REASON Company announces strategic focus on new technology applications. [lever_c_demoted from significant: ic=1 ai=0.4]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

BOE Technology eyes glass substrate, perovskite, and MicroLED for future growth

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Company announces strategic focus on new technology applications. [lever_c_demoted from significant: ic=1 ai=0.4]
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    BOE A: Arranging glass substrate packaging carrier boards, perovskites, and MicroLED optical interconnection related applications as important directions for future business development

    京东方A在机构调研时表示，围绕公司多年来积累的显示技术、玻璃基加工能力和大规模集成智造能力三大核心优势，根据“第N曲线”理论指导下的“屏之物联”战略，公司通过相关能力的复用，布局玻璃基封装载板、钙钛矿和MicroLED光互联相关应用作为未来业务发展的重要方向。（财联社）

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