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中文(ZH) 通合科技:拟募集不超5.22亿元,用于数据中心用供配电系统及模块研发生产项目等

Tonghe Technology to raise 522M yuan for data center power systems

Tonghe Technology plans to raise up to 522 million yuan through convertible bonds. The funds will be allocated to research and development for power distribution systems and modules used in data centers, as well as for supplementing working capital. This move aims to bolster the company's infrastructure for data center technology. AI

IMPACT This funding will support the development of critical infrastructure for data centers, which are essential for AI operations and scaling.

RANK_REASON Company funding round exceeding $100M. [lever_c_demoted from significant: ic=1 ai=0.7]

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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Tonghe Technology: Plans to raise no more than 522 million yuan for R&D and production projects of power supply and distribution systems and modules for data centers, among others.

    36氪获悉,通合科技公告,公司董事会审议通过向不特定对象发行可转债方案,募集资金总额不超过5.22亿元,用于数据中心用供配电系统及模块研发生产项目及补充流动资金。