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Huawei touts chip breakthrough to shorten gap with TSMC

Huawei announced a significant advancement in chip manufacturing, developing a new AI

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Huawei touts chip breakthrough to shorten gap with TSMC

COVERAGE [1]

  1. Fortune TIER_1 · Bloomberg ·

    Huawei touts chip breakthrough to shorten gap with TSMC

    Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said Monday.