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GlobalFoundries targets 2030 for 7nm-class chip production using EUV-free FDX Fusion

GlobalFoundries is developing FDX Fusion, a new manufacturing process that aims to deliver 7nm-class performance without relying on expensive extreme ultraviolet (EUV) lithography tools. This technology utilizes advanced planar transistors and FD-SOI (fully depleted silicon-on-insulator) architecture, targeting high-volume manufacturing by 2030. The process is designed for applications such as connectivity chips, edge microcontrollers, automotive radar, and data center components focused on power and connectivity. AI

IMPACT This advancement in chip manufacturing could enable more cost-effective production of AI-specific hardware, potentially accelerating AI adoption.

RANK_REASON Semiconductor manufacturing process announcement with a clear target date and performance metrics. [lever_c_demoted from significant: ic=1 ai=0.7]

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AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

GlobalFoundries targets 2030 for 7nm-class chip production using EUV-free FDX Fusion

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Semiconductor manufacturing process announcement with a clear target date and performance metrics. [lever_c_demoted from significant: ic=1 ai=0.7]
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High
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COVERAGE [1]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow

    GlobalFoundries reveals new details about its FDX Fusion technology, which promises 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography, shares what is next for FDX Fusion node, and the FDX program in general.