GlobalFoundries is developing FDX Fusion, a new manufacturing process that aims to deliver 7nm-class performance without relying on expensive extreme ultraviolet (EUV) lithography tools. This technology utilizes advanced planar transistors and FD-SOI (fully depleted silicon-on-insulator) architecture, targeting high-volume manufacturing by 2030. The process is designed for applications such as connectivity chips, edge microcontrollers, automotive radar, and data center components focused on power and connectivity. AI
IMPACT This advancement in chip manufacturing could enable more cost-effective production of AI-specific hardware, potentially accelerating AI adoption.
RANK_REASON Semiconductor manufacturing process announcement with a clear target date and performance metrics. [lever_c_demoted from significant: ic=1 ai=0.7]
- 2030
- 7 nm lithography process
- Alif Semiconductors
- extreme ultraviolet lithography
- FD-SOI
- FDX Fusion
- GlobalFoundries
- Sudipto Bose
- Texas Instruments
- Tom's Hardware
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