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New EnergyPlus object models liquid-cooled data centers for AI workloads

By PulseAugur Editorial · [1 sources] ·

Researchers have developed a new EnergyPlus object, ElectricEquipment:ITE:LiquidCooled, to accurately model direct-to-chip liquid cooling systems in data centers. This advancement addresses the limitations of existing tools in evaluating the long-term energy efficiency of high-density AI infrastructure. The new model integrates various components of liquid cooling, from facility water loops to chip-junction temperatures, and has been validated against an independent Modelica implementation with high accuracy. A case study showed that warm-water liquid cooling significantly reduces Power Usage Effectiveness (PUE) and overall facility energy consumption compared to traditional air-cooled systems. AI

IMPACT Enables more accurate energy efficiency modeling for AI-driven data center infrastructure.

RANK_REASON Academic paper detailing a new modeling approach for data center infrastructure. [lever_c_demoted from research: ic=1 ai=0.7]

Read on arXiv cs.LG →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

New EnergyPlus object models liquid-cooled data centers for AI workloads

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Academic paper detailing a new modeling approach for data center infrastructure. [lever_c_demoted from research: ic=1 ai=0.7]
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infra, paper
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High
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Breaking (< 6h)
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COVERAGE [1]

  1. arXiv cs.LG TIER_1 English(EN) · Yun-Dam Ko, Dipashreya A. Sur, Cade Napier, Carlos D. D\'iaz-Mar\'in, Rishee K. Jain ·

    Modeling Liquid-Cooled Data Centers in EnergyPlus

    arXiv:2610.33148v1 Announce Type: cross Abstract: As AI workloads accelerate data center transition toward high-density racks with direct-to-chip (DTC) liquid cooling, existing simulation tools remain limited in evaluating whole-building and multi-year efficiency. To bridge this …

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