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中文(ZH) 一层“布”涨价270%之后,投资机构用数亿元投票玻璃基板,巽霖科技完成近2亿元B轮融资

AI substrate crunch fuels Xunlin Tech's 200M yuan glass substrate funding

Xunlin Technology, a Chinese company specializing in glass substrate technology, has secured nearly 200 million yuan in its third funding round within six months. This Series B funding, led by Inno-Origin and other new and existing investors, will support the expansion of its glass substrate production capacity, the establishment of packaging lines, and research into advanced manufacturing processes. The company's growth is driven by the increasing demand for AI server components, where organic substrates are facing supply shortages and price hikes due to limitations in electronic-grade glass fiber cloth. Xunlin Technology aims to capitalize on this market shift by offering glass substrates as a superior and potentially more cost-effective alternative for various applications, including AI server backplanes, high-frequency communication boards, and advanced packaging substrates. AI

IMPACT This funding could accelerate the adoption of glass substrates, potentially alleviating supply chain bottlenecks for AI hardware and improving performance.

RANK_REASON Significant funding round for a company in a critical emerging technology sector (glass substrates for AI hardware) driven by market shifts. [lever_c_demoted from significant: ic=1 ai=0.7]

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AI substrate crunch fuels Xunlin Tech's 200M yuan glass substrate funding

COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    After a 270% increase in the price of a layer of "cloth", investment institutions voted with hundreds of millions of yuan for glass substrates, and Sunlin Technology completed a nearly 200 million yuan Series B financing.

    <p><strong>【导语】当前,电子级玻纤布价格较2025年低点翻倍、FR-4覆铜板涨幅超270%,AI封装载板部分交期拉长至6个月以上,有机基板供给危机持续加深。在此背景下,</strong>国内玻璃基板领军企业巽霖科技宣布完成近2亿元B轮融资——这已是该公司半年内完成的第三轮次融资。本轮由英诺基金、千乘资本、海目星、光莆股份、同鑫资本等新股东投资,金雨茂物、海通开元、北岸产投等老股东持续加码。募集资金将主要投向玻璃基板产能扩张、封装产线建设投产、制程精度升级研发,以及光通讯前沿应用布局。</p> <p>&nbsp;</p> <h2><strong…