Leading semiconductor foundries TSMC, Intel, Samsung, and GlobalFoundries are developing strategies for Co-Packaged Optics (CPO) to meet the escalating bandwidth demands of AI infrastructure. CPO technology integrates optical interfaces directly into or adjacent to processors like CPUs and GPUs, overcoming the limitations of traditional electrical interconnects for high-speed data transfer. This shift is driven by the need for increased bandwidth density and reduced power consumption in AI data centers, with TSMC's COUPE roadmap and advanced packaging technologies being particularly influential. AI
IMPACT Accelerates the development of AI infrastructure by enabling higher bandwidth and lower power consumption for processors.
RANK_REASON Industry-wide development and roadmaps from major semiconductor foundries for a critical enabling technology (CPO) for AI infrastructure. [lever_c_demoted from significant: ic=1 ai=0.7]
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