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中文(ZH) 国金证券：AI光模块+NV-CoWoP预计将带动mSAP-PCB快速扩容

AI optical modules and NV-CoWoS to drive mSAP-PCB expansion, says Guojin Securities

By PulseAugur Editorial · [1 sources] ·

Guojin Securities research indicates that AI optical modules and NV-CoWoS packaging are expected to drive significant expansion in mSAP-PCB production. The report highlights that mSAP technology, suitable for high-precision applications with line widths and spacings below 15μm, faces technical challenges in copper plating and etching processes. The expansion of mSAP-PCB is anticipated to boost demand for upstream materials, including direct-write lithography, electroplating lines, carrier copper foil, and specialized laminates. AI

IMPACT Anticipated expansion in mSAP-PCB production driven by AI optical modules and NV-CoWoS could impact the supply chain for advanced electronics manufacturing.

RANK_REASON Analyst report discussing market trends and technological drivers for PCB manufacturing.

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

AI optical modules and NV-CoWoS to drive mSAP-PCB expansion, says Guojin Securities

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Analyst report discussing market trends and technological drivers for PCB manufacturing.
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infra, product
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88 days old
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Guojin Securities: AI optical modules + NV-CoWoP are expected to drive rapid expansion of mSAP-PCB

    36氪获悉，国金证券研报指出，mSAP工艺适用于线宽线距要求高的应用场景（线宽/线距可达15um以下），技术难点环节主要在基铜、电镀、闪蚀等。mSAP最初应用场景主要为消费电子，AI光模块+NV-CoWoP预计将带动mSAP-PCB快速扩容。mSAP-PCB对于上游材料的拉动方面，建议关注①直写光刻，②电镀线，③载体铜箔，④药水，⑤low-CTE电子布，⑥low-dk二代布、HVLP4铜箔等方向。

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