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中文(ZH) 蓝思科技：与Intel签署合作备忘录，重点关注TGV先��封装

Lens Technology partners with Intel on advanced packaging

By PulseAugur Editorial · [1 sources] ·

Lens Technology has signed a memorandum of cooperation with Intel to explore advanced packaging technologies, specifically focusing on TGV (Through-Glass Via) advanced packaging. The collaboration will involve discussions and evaluations of key processes such as glass substrate drilling, high-precision laser processing, and metallization, with Intel providing technical guidance and validation methods. This partnership highlights Lens Technology's potential role in Intel's advanced packaging supply chain. AI

IMPACT This collaboration could lead to advancements in semiconductor packaging, potentially impacting the performance and efficiency of AI hardware.

RANK_REASON Partnership between a component supplier and a chip manufacturer for technology development.

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

Lens Technology partners with Intel on advanced packaging

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Partnership between a component supplier and a chip manufacturer for technology development.
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Only one publisher covered this so far. Single-source stories can still rank when the publisher is high-authority, but they lack cross-source corroboration.
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product, infra
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High
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76 days old
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Lens Technology: Signs Memorandum of Understanding with Intel, Focusing on TGV Advanced Packaging

    36氪获悉，蓝思科技公告，全资子公司蓝思国际（香港）有限公司于近日与Intel Corporation（以下简称“Intel”）签署了合作备忘录。双方将TGV先进封装作为本备忘录下讨论的重点方向，Intel视蓝思科技为此领域有价值的潜在合作方。双方将就玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺（包括但不限于上述内容）相关的潜在合作进行讨论和评估，Intel将提供说明性架构信息、可制造性设计（DFM）指南、基准测试方法和验证方法。

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