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中文(ZH) “他山科技”完成数亿元B轮融资

HeShan Tech raises hundreds of millions in Series B; Databento secures $97M

By PulseAugur Editorial · [1 sources] ·

HeShan Technology has secured several hundred million yuan in Series B funding, with participation from industrial investors like Junsheng Electronics and existing shareholders such as Daosheng Technology. The funds will support the iteration of their haptic sensors and chips, the implementation of scenario-based solutions, and the development of a haptic training platform. Separately, Databento, a global financial market data infrastructure provider, closed a $97 million Series B round led by NEA, intending to expand its global asset coverage, regional market presence, and data infrastructure. AI

IMPACT This cluster highlights investment trends in AI-adjacent infrastructure and hardware, indicating continued capital flow into specialized technology sectors.

RANK_REASON The cluster reports on two distinct funding rounds for technology companies, one in hardware and one in data infrastructure. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

HeShan Tech raises hundreds of millions in Series B; Databento secures $97M

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Signal score
0 / 100
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Newsworthiness bucket
Research
The cluster reports on two distinct funding rounds for technology companies, one in hardware and one in data infrastructure. [lever_c_demoted from significant: ic=1 ai=0.7]
Source corroboration
Single-source cluster
Only one publisher covered this so far. Single-source stories can still rank when the publisher is high-authority, but they lack cross-source corroboration.
Topics
funding, infra
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High
Clearly on-topic for AI-industry coverage.
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90 days old
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    "Taishan Technology" Completes Hundreds of Millions of Yuan in Series B Financing

    36氪获悉，“他山科技”已于近期完成B轮融资，金额为数亿元。本轮投资方包括均胜电子、太平创新、奥克斯、鹏翎股份、Lavender Hill Capital Partners（LHCP）、洪山资本等产业方，老股东道氏技术、彬复资本追加投资。资金将主要用于触觉传感器及芯片迭代、场景化方案落地及触觉训练平台建设。

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