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SemiAnalysis details RDL integration challenges and GUC's STCO flow at ECTC

By PulseAugur Editorial · [3 sources] ·

SemiAnalysis discussed advancements in chip integration and signal integrity at ECTC, highlighting the complexities of optimizing RDL (re-routing delivery) technology. Global Unichip Corporation (GUC) demonstrated a practical STCO flow for CoWoS-R style UCIe-A integration, which involves intricate pre-layout and post-layout electromagnetic simulations. The discussion emphasized that at high data rates, the physical geometry of RDL becomes critical to channel performance, requiring careful tuning of multiple layers and structures for enhanced bandwidth and signal integrity. AI

IMPACT Highlights advancements in chip integration and signal integrity crucial for high-performance computing and AI hardware.

RANK_REASON The cluster discusses technical advancements and challenges in chip integration and signal integrity presented at a conference.

Read on X — SemiAnalysis →

AI-generated summary · Google Gemini · from 3 sources. How we write summaries →

SemiAnalysis details RDL integration challenges and GUC's STCO flow at ECTC

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COVERAGE [3]

  1. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    🟠 The challenge is co-optimizing SI and PI at the same time. Line width, spacing, ground placement, via location, PDN plane shape, and routing density all move

    🟠 The challenge is co-optimizing SI and PI at the same time. Line width, spacing, ground placement, via location, PDN plane shape, and routing density all move insertion loss, return loss, crosstalk, impedance peaks, and power noise. Check out our newsletter on ECTC 2026

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    🟠 The key point is that RDL is not just “wires and polymers.” At 16 to 36 GT/s, the geometry becomes part of the channel. GUC uses GSG-interleaved transmission

    🟠 The key point is that RDL is not just “wires and polymers.” At 16 to 36 GT/s, the geometry becomes part of the channel. GUC uses GSG-interleaved transmission lines, where ground shielding traces surround the signal lines to improve isolation and help skew compensation. The

  3. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    At ECTC, GUC showed a practical STCO flow for CoWoS-R style UCIe-A integration, moving from pre-layout 2D EM exploration to post-layout 3D EM extraction, transi

    At ECTC, GUC showed a practical STCO flow for CoWoS-R style UCIe-A integration, moving from pre-layout 2D EM exploration to post-layout 3D EM extraction, transient eye simulation, PDN impedance analysis, and final power-aware SI signoff. (1/3)🧵 https://t.co/gwRP5u4su9

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