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中文(ZH) 台积电大幅扩展PIC产能，预计2028年将达到每月2.5万片

TSMC to drastically expand PIC capacity, reaching 25,000 wafers/month by 2028

By PulseAugur Editorial · [1 sources] ·

TSMC is significantly expanding its Photonic Integrated Circuit (PIC) production capacity, with projections indicating a rise from the current 500 wafers per month to 10,000 by Q2 2026 and 15,000 by Q4 2026. The company aims to reach at least 25,000 wafers per month by 2028. This expansion is expected to dramatically increase annual PIC output, from approximately 4 million dies to 78 million, and potentially up to 194 million dies at the 2028 capacity level. AI

IMPACT Increased production of PICs could accelerate advancements in AI hardware and high-speed data transmission.

RANK_REASON Significant expansion of manufacturing capacity for a key component in AI and high-performance computing. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

TSMC to drastically expand PIC capacity, reaching 25,000 wafers/month by 2028

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Significant expansion of manufacturing capacity for a key component in AI and high-performance computing. [lever_c_demoted from significant: ic=1 ai=0.7]
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    TSMC significantly expands PIC capacity, expecting to reach 25,000 wafers per month by 2028

    据机构预测，台积电光子集成电路（PIC）的产能将迎来快速攀升。台积电产能将从目前约每月500片的水平，拉升至2026年第二季度的每月1万片，第四季度将进一步提高至每月1.5万片，并预计在2028年增至至少每月2.5万片。机构估算，若按每片晶圆包含648颗裸片（die）计算，台积电PIC月产能从500片提升至1万片后，其年化产出量将由约400万颗大幅提升至7800万颗。若产能进一步达到每月2.5万片，年化PIC产出量预计将达到1.94亿颗。（界面）

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