TSMC is significantly expanding its Photonic Integrated Circuit (PIC) production capacity, with projections indicating a rise from the current 500 wafers per month to 10,000 by Q2 2026 and 15,000 by Q4 2026. The company aims to reach at least 25,000 wafers per month by 2028. This expansion is expected to dramatically increase annual PIC output, from approximately 4 million dies to 78 million, and potentially up to 194 million dies at the 2028 capacity level. AI
IMPACT Increased production of PICs could accelerate advancements in AI hardware and high-speed data transmission.
RANK_REASON Significant expansion of manufacturing capacity for a key component in AI and high-performance computing. [lever_c_demoted from significant: ic=1 ai=0.7]
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