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日本語(JA) 8月28日(金)13:00-17:25に、NPO法人サーキットネットワーク(C-NET)が第28回定期講演会『がんばれニッポン! PART IV 〜AIを支える半導体は〜』をオンライン開催。講演5件。AI用の半導体/半導体パッケージ、AIチップ、推論、エージェントAI、フィジカルAI、モビリティ、パッケージング技術。詳

NPO C-NET to Host Seminar on AI Semiconductors and Packaging Technology

NPO法人サーキットネットワーク (C-NET) is hosting its 28th online seminar, "Go Nippon! PART IV ~What are the Semiconductors Supporting AI?~" on August 28th. The event will feature five talks covering AI semiconductors, packaging technology, AI chips, inference, agent AI, and physical AI. The seminar aims to discuss the semiconductor technologies that underpin artificial intelligence. AI

IMPACT This seminar will explore the semiconductor technologies crucial for advancing AI capabilities, including AI chips and packaging.

RANK_REASON The item describes an upcoming seminar discussing AI and semiconductors, which is not a primary release or significant industry event.

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NPO C-NET to Host Seminar on AI Semiconductors and Packaging Technology

COVERAGE [1]

  1. Mastodon — fosstodon.org TIER_1 日本語(JA) · [email protected] ·

    On Friday, August 28, from 1:00 PM to 5:25 PM, NPO Circuit Network (C-NET) will hold its 28th Regular Lecture Meeting, "Go, Nippon! PART IV ~What are the Semiconductors Supporting AI?~" online. Five lectures. Semiconductors/Semiconductor Packages for AI, AI Chips, Inference, Agent AI, Physical AI, Mobility, Packaging Technology. Details

    8月28日(金)13:00-17:25に、NPO法人サーキットネットワーク(C-NET)が第28回定期講演会『がんばれニッポン! PART IV 〜AIを支える半導体は〜』をオンライン開催。講演5件。AI用の半導体/半導体パッケージ、AIチップ、推論、エージェントAI、フィジカルAI、モビリティ、パッケージング技術。詳細は https:// jisso.jp/web/cnet29.html に。 # CNET # Seminar # Semiconductor # AI