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中文(ZH) 3天2板长电科技:拟投资78亿元建设高端先进封测工厂

长电科技 invests 7.8B yuan in advanced chip packaging factory

Changjiang Electronics Technology (长电科技) plans to invest 7.8 billion yuan in a new high-end advanced packaging and testing factory in Shanghai's Lingang New Area. The project, which will be completed in two phases with the first phase expected by the second half of 2028, aims to expand high-end advanced packaging capacity and enhance overall competitiveness. Separately, Jinli Permanent Magnet (金力永磁) will acquire a 9.24% stake in Baotou Rare Earth Products Exchange Co., Ltd. for approximately 22.08 million yuan to improve its rare earth raw material supply security. AI

IMPACT This investment in advanced chip packaging capacity is crucial for supporting the increasing demand for AI chips and advanced computing hardware.

RANK_REASON Significant investment in advanced manufacturing infrastructure for the semiconductor industry. [lever_c_demoted from significant: ic=1 ai=0.7]

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长电科技 invests 7.8B yuan in advanced chip packaging factory

COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    3 days 2 boards Changdian Technology: plans to invest 7.8 billion yuan to build a high-end advanced packaging and testing factory

    36氪获悉,长电科技公告,公司拟通过设立控股子公司,在上海临港新片区建设高端先进封测工厂,投资总额78亿元,其中注册资本预计40亿元。项目分两期建设,一期包括厂房建设、装修工程及设备投资等,计划2028年下半年完成。本次投资旨在加快高端先进封装产能布局,提升综合竞争力。