Zhongfu Circuit: Plans to raise no more than 850 million yuan through private placement for AI PCB production line renovation and expansion projects.
Zhongfu Circuit plans to raise up to 850 million yuan through a private placement to fund the expansion and renovation of its AI-specific PCB production lines. The company also aims to use these funds for digital upgrade projects and to supplement working capital. Separately, Tongye Technology has terminated its acquisition of Beijing Silingke Semiconductor Technology Co., Ltd. due to significant changes in the transaction's feasibility. AI
IMPACT This funding will enable Zhongfu Circuit to scale up production of specialized PCBs crucial for AI hardware, potentially easing supply chain constraints for AI infrastructure.