BOE A: Arranging glass substrate packaging carrier boards, perovskites, and MicroLED optical interconnection related applications as important directions for future business development
BOE Technology Group is focusing on glass substrate packaging, perovskite, and MicroLED optical interconnect applications as key future business directions. This strategy leverages their established display technology, glass substrate processing, and large-scale integrated manufacturing capabilities. The company also noted that TV panel prices saw a general increase from January to April 2026 due to factors like sports event demand and cost pressures, with prices stabilizing in May. AI
IMPACT Focus on advanced materials and interconnects could enable future AI hardware advancements.