Han's Laser: Panel-level glass substrate through-hole equipment has been shipped
Di'er Laser has successfully shipped its through-hole equipment for glass substrates used in panel-level packaging. The company's TGV laser micro-hole equipment is applicable to semiconductor chip packaging and display chip packaging, having achieved comprehensive coverage of laser technology for wafer-level and panel-level packaging. AI
IMPACT This specific equipment shipment is a niche tooling improvement with minimal direct industry-wide impact on AI operations.