Advanced Packaging Leads The Way To Intel Foundry Success
Intel's advanced semiconductor packaging capabilities are proving to be a significant asset for its foundry business, potentially overshadowing its struggles with leading-edge process nodes. While Intel has met its targets for new fabrication processes like Intel 18A, customer adoption for these nodes is still in its early stages. In contrast, Intel's expertise in packaging technologies, such as EMIB and Foveros, has generated immediate interest and business, with facilities in Malaysia and New Mexico playing a crucial role. The company is also pioneering new materials like glass substrates for packaging, further solidifying its position in this critical area of semiconductor manufacturing. AI
IMPACT Intel's advanced packaging capabilities are crucial for the performance and integration of AI chips, potentially impacting the efficiency and cost of AI hardware.
