Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
Huawei has announced a new chip architecture called 'LogicFolding' that aims to bypass US sanctions and achieve '1.4nm-class' transistor density by 2031. This new design, based on a 'Tau Scaling Law' that prioritizes signal speed over component size, allows for stacked logic circuits to increase transistor density by 55%. The technology is expected to debut in upcoming Kirin smartphone processors and later be applied to AI and data center chips, potentially offering alternatives to restricted foreign hardware. AI
IMPACT This development could provide China with domestic alternatives for AI and data center chips, potentially impacting global supply chains and competition.