Co-Packaged Optics: The Interconnect Backbone for AI Data Centers
The increasing demand for AI data centers, driven by large language models and AI agents, has created a significant bottleneck in communication links between GPUs. This bottleneck, where GPUs spend more time waiting for data than computing, highlights the need for advanced interconnect solutions. Co-packaged optics are emerging as a critical technology to address this challenge by providing a more efficient backbone for data center communication. AI
IMPACT Co-packaged optics are poised to become essential for scaling AI data centers, addressing GPU communication bottlenecks and enabling more efficient AI computation.